International Research journal of Management Sociology & Humanities
( ISSN 2277 - 9809 (online) ISSN 2348 - 9359 (Print) ) New DOI : 10.32804/IRJMSH
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ELECTRODEPOSITION OF COPPER TELLURIUM COMPOUND UNDER DIFFUSION LIMITING CONTROL
2 Author(s): MUKESH SHEORAN, DR. ARUNESH KUMAR
Vol - 3, Issue- 1 , Page(s) : 297 - 306 (2012 ) DOI : https://doi.org/10.32804/IRJMSH
The effect of tellurium on sulphate solution as impurity was analysed during electrodeposition of copper. The effects of tertiary concentration at macro- and micro-level were systematically analysed on current quality, chemical and morphological structure. The low-cost industrial applicant for solar cell production is electrodeposition (ED). However, owing to the dynamic co-cutting variables that must still be grasped for global alloy ED, the functional dimensions of regulating deposit morphology and composition were not substantially discussed. The layout of the film was observed to have a cubic orientation around (200) plane. The microstructural parameters including crystallite scale, strain, dislocation density and the likelihood of a storage error were determined using X-ray diffraction data.